About the role
What We're Looking For:
We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages.
This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.
Ideal Background: • Experience with integrated photonics package assemblies with multiple dies • Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors • Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc.
Nice to Have: • Experience with large device count photonic assemblies • Experience with clear underfill • Experience with high density fiber attach • Experience with large substrate size photonic MCM assemblies • Hands-on experience with PIC design
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